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custom manufacture 2-Layer RT/duroid 5870 High-Frequency PCB – 10mil (0.3mm) laminate with ENIG Finish

Shenzhen Bicheng Electronics Technology Co., Ltd
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custom manufacture 2-Layer RT/duroid 5870 High-Frequency PCB – 10mil (0.3mm) laminate with ENIG Finish

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Brand Name : Rogers

Model Number : RT/duroid 5870

Certification : ISO9001

Place of Origin : China

MOQ : 1PCS

Price : 0.99-99USD/PCS

Payment Terms : T/T, Paypal

Supply Ability : 50000pcs

Delivery Time : 2-10 working days

Packaging Details : Packing

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2-Layer RT/duroid 5870 High-Frequency PCB – 10mil (0.3mm) with ENIG Finish

Product Introduction

We present our 2-Layer RT/duroid 5870 PCB – an ultra-thin, high-performance circuit board engineered for demanding stripline, microstrip, and millimeter-wave applications. Fabricated with Rogers RT/duroid 5870 glass microfiber-reinforced PTFE laminate and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.3mm (10mil) board delivers an exceptionally low and stable dielectric constant (Dk 2.33 ±0.02 @ 10 GHz) and ultra-low dissipation factor (Df 0.0012). The randomly oriented glass microfibers ensure isotropic electrical properties and uniform Dk from panel to panel – critical for phase-sensitive designs up to Ku-band and beyond.

Key Specifications

Parameter Details
Base Material Rogers RT/duroid 5870 (Glass microfiber-reinforced PTFE)
Layer Count 2 Layers (Double-sided)
Finished Thickness 0.3 mm (10 mil)
Copper Weight 1 oz (35 μm) on both outer layers
Min Trace/Space 5 / 6 mils
Min Hole Size 0.4 mm (Mechanical drilling)
Via Plating Thickness 20 μm
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Solder Mask None (Top & Bottom)
Silkscreen None (Top & Bottom)
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Accepted Standard IPC-Class-2
Availability Worldwide

PCB Stackup (2-Layer Rigid)

Layer Material Thickness
Top Copper 1 oz (35 μm)
Substrate Rogers RT/duroid 5870 0.254 mm (10 mil)
Bottom Copper 1 oz (35 μm)

Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.

PCB Statistics

Dimensions: 85 mm × 36 mm ±0.15 mm (1 piece)

Components: 36

Total Pads: 56 (32 thru-hole, 24 SMT on top, 0 on bottom)

Vias: 28

Nets: 2

Why RT/duroid 5870?

RT/duroid 5870 is a glass microfiber-reinforced PTFE composite designed for exacting high-frequency circuits. Unlike woven-glass reinforced materials, the randomly oriented microfibers eliminate Dk variation caused by glass weave effects – delivering exceptional dielectric constant uniformity from panel to panel and across frequency. With the lowest electrical loss of any reinforced PTFE material, RT/duroid 5870 extends its usefulness to Ku-band, K-band, and millimeter-wave frequencies while remaining easily machinable using standard PTFE fabrication methods.

Key Features of RT/duroid 5870

Parameter Value
Dielectric Constant (Dk) 2.33 ±0.02 @ 10 GHz
Dissipation Factor (Df) 0.0012 @ 10 GHz
Temperature Coefficient of Dk (TCDk) -115 ppm/°C
Moisture Absorption 0.02% (ultra-low)
CTE – X axis 22 ppm/°C
CTE – Y axis 28 ppm/°C
CTE – Z axis 173 ppm/°C
Isotropic Yes (random microfiber reinforcement)

Benefits of This 10mil RT/duroid 5870 PCB

Ultra-Low & Stable Dk (2.33 ±0.02): Tight tolerance ensures predictable impedance and phase matching – critical for phased arrays and beamforming networks.

Lowest Loss Reinforced PTFE: Df of 0.0012 at 10 GHz – extends performance to Ku-band and millimeter-wave (up to 100 GHz+).

No Glass Weave Effect: Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE – ideal for long differential pairs and phase-sensitive circuits.

Uniform Panel-to-Panel: Consistent electrical properties simplify high-volume production without per-panel tuning.

Ultra-Thin 10mil Profile: Enables compact, low-profile designs and controlled impedance with narrow trace widths.

Process-Friendly: Easily cut, sheared, and machined to shape. Resistant to all solvents and reagents used in etching or plating edges and holes.

ENIG Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (24 top pads). No solder mask preserves RF performance on exposed traces.

High Moisture Resistance: 0.02% moisture absorption ensures stable electrical performance in humid environments.

Quality Assurance

100% electrical testing prior to shipment

IPC-Class-2 compliance

Full Gerber RS-274-X acceptance

ISO 9001 certified production

Typical Applications

Commercial Airline Broadband Antennas (In-Flight Connectivity)

Microstrip & Stripline Circuits (High-frequency filters, couplers, power dividers)

Millimeter-Wave Applications (5G NR FR2, E-band, V-band)

Radar Systems (Automotive, defense, weather)

Guidance Systems (Missile, drone, navigation)

Point-to-Point Digital Radio Antennas (Backhaul, microwave links)

Satellite Communication Downconverters

Test & Measurement Fixtures (Up to 100 GHz)


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