When a design demands high dielectric constant, low loss, and the mechanical robustness of woven glass reinforcement, the RO3210 laminate from Rogers Corporation delivers a compelling combination. Part of the RO3200™ series, this ceramic-filled, woven fiberglass-reinforced PTFE composite was engineered as an extension of the RO3000® series with one distinguishing characteristic—improved mechanical stability.
RO3200 series laminates combine the surface smoothness of a non-woven PTFE laminate, enabling finer line etching tolerances, with the rigidity of a woven glass PTFE laminate. This makes them well suited to multilayer constructions where dimensional stability and reliable plated through-holes are essential. RO3210 offers a dielectric constant of 10.2 with a dissipation factor of 0.0027, and can be fabricated using standard PTFE circuit board processing techniques. The material is manufactured under an ISO 9002 certified quality system.
| Property | Typical Value RO3210 | Direction | Unit | Condition | Test Method |
| Dielectric Constant, er Process | 10.2± 0.50 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5
Clamped Stripline |
| Dielectric Constant, er Design | 10.8 | Z | - | 8 GHz - 40 GHz | Differential Phase Length Method |
| Dissipation Factor, tan d | 0.0027 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of er | -459 | Z | ppm/°C | 10 GHz 0-100°C | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X,Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | | MW•cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 103 | | MW | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 579
517 | MD CMD | kpsi | 23°C | ASTM D638 |
| Water Absorption | <0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | | J/g/K | | Calculated |
| Thermal Conductivity | 0.81 | - | W/m/K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion (-55 to 288 °C) | 13
34 | X,Y, Z | ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | | °C | TGA | ASTM D3850 |
| Color | Off White | | | | |
| Density | 3.0 | | gm/cm3 | | |
| Copper Peel Strength | 11.0 | | pli | 1 oz. EDC
After Solder Float | IPC-TM-2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead Free Process Compatible | YES | | | | |
| PCB Capability (RO3210) |
| PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
| Designation: | RO3210 |
| Dielectric constant: | 10.2±0.5 |
| Layer count: | Single Layer, Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 25mil(0.635mm), 50mil (1.27mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, Immersion tin, Immersion silver, Immersion gold, Pure gold, ENEPIG, OSP etc.. |
Applications
- Microwave and RF Circuits – Filters, couplers, and matching networks
- Patch Antennas – Reduced element size through high Dk
- Phased Array Antennas – Stable performance across elements
- Satellite Communications – Reliable operation in demanding environments
- Radar Systems – Ground-based and airborne radar front-ends
- Multilayer Constructions – Reliable stripline and multilayer board designs
- Power Amplifiers and Combiners – High Dk for compact power combining networks
Custom PCB Manufacturing on RO3210
As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers RO3210 and other advanced materials. The following specification details a representative 4-layer multilayer implementation:
PCB Construction Details:
| Parameter | Specification |
| Configuration | 4-layer copper construction |
| Stack-up | 0.508mm RO3210 + 0.2mm RO4450F PP + 0.508mm RO3210 |
| Laminated Thickness | 1.22mm |
| Copper Weight | 1 oz finished copper on outer and inner layers |
| Surface Finish | Silver and gold plating |
| Solder Mask | Double-sided (no ink/markings) |
| Silkscreen | None |
| Board Dimensions | 79mm × 79mm (1 piece) |
| Special Feature | Controlled-depth slots |
| Quality Standard | IPC-Class-2 |
Stack-up Configuration:
Material Advantages
With a Dk of 10.2, RO3210 enables significant size reduction in RF and microwave circuits. This makes it an excellent choice for patch antennas, filters, and other components where footprint is at a premium, and where a higher Dk allows circuit dimensions to be reduced.
The distinguishing characteristic of the RO3200 series is improved mechanical stability compared to the RO3000 series. The woven fiberglass reinforcement provides rigidity and dimensional stability, making the material well suited to multilayer board constructions where warpage and registration are concerns.
RO3210 combines the surface smoothness of a non-woven PTFE laminate with the rigidity of a woven glass PTFE laminate. This smooth surface enables finer line etching tolerances, supporting tight trace/space requirements and consistent impedance control.
A dissipation factor of 0.0027 is low for a material with such a high dielectric constant, ensuring acceptable efficiency in miniaturized antennas and filters.
RO3210 can be paired with RO4450F prepreg (as demonstrated in the 4-layer stack-up above) to build reliable multilayer constructions. The material can be fabricated using standard PTFE circuit board processing techniques, with minor modifications.
The demonstrated PCB implementation includes controlled-depth slots, allowing precise control of dielectric exposure and enabling unique mechanical and electrical functionality in the finished board.
RO3200 series laminates are manufactured under an ISO 9002 certified quality system, ensuring consistent quality and reliability.
Quality and Availability
All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.
Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.
For inquiries about custom stack-ups, multilayer configurations using RO3210 and RO4450F prepreg, controlled-depth slots, alternative surface finishes (silver, gold, ENIG), or other requirements, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.
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Rogers RO3210 high DK10.2 High-Frequency Laminate and Custom Multilayer PCB built on 0.508mm core RO3210+0.2mm RO4450F PP Images
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